How to Clean and Scrap SMT Stencils

 

After the Production Line Has Stopped Running:

1. Disassemble the stencils. Remove any remaining welding paste from the front of the stencil using a scraper and throw away the dried paste.

2. Spray a cleaning agent evenly onto the stencils and wipe them with the wiping paper until the welding paste is gone and there are no impurities visible on either the upper or lower side of the stencil.

3. Wipe the stencils on both the upper and the lower side with two pieces of wiping papers, using a cleaning agent. Continue until there is no visible welding paste residue.

4. The stencil holes should be blown out thoroughly using an air gun, in order to blow them from top to left and from bottom to right. Pay special attention to BGA, QFP and the smaller spacing IC area.

5. Repeat the cleaning process until the stencil holes are clean.

Shenzhen Guangming District, SMT Processing Factory: Scrapping Stencils

1. After confirmation by the engineering staff, stencils that are damaged and cannot guarantee normal silkscreen characters will be scrapped. The stencils that have been scrapped should be marked outside the outer frame, and then placed in the scrapped-stencils area.

2. If the tension of the steel plate 55*65 is less than 30N/cm or that of the stencils 42*52 is less than 25N/cm and the maximum tension difference is greater than 10N/cm then it should be scrapped.

3. This steel plate must be scrapped if the total number of productions and prints exceeds 50,000.

4. The engineering staff confirms that it was a result of the PCB upgrade and discards it.

5. The stencils must be reopened due to the quality improvement. The stencils that were used before the improvement are discarded.

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