Gluing and pouring glue methods for SMT assembly

SMT assembly is a significant process in electronic products manufacturing, among which gluing and filling are the vital processes.

Gluing and pouring glue packages and protects electronic components, improves the product’s waterproof, dustproof, and shockproof properties, and plays a role in heat conduction and insulation.

The difference between gluing and filling

Gluing and pouring glue are two different processes.

Gluing means squeezing the glue directly to where it needs to be stuck while pouring glue means injecting the gum into the reserved space.

We use the gluing for bonding small areas. The pouring glue is used for bonding large areas or spaces that need to be filled.

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